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产品规格

封装/外壳	8-SMD
制造商	Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
安装类型	表面贴装
工作温度	-40°C ~ 125°C
类型	SAW
系列	B39301
包装	剪切带（CT）
频率	304.3MHz
频率稳定度	-
大小/尺寸	0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）
零件状态	过期
频率容差	-
高度	0.053"（1.35mm）
特性	-
电容	-
阻抗	50 欧姆
关键词

产品资料

标准包装	1
其它名称	495-2343-1

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