关于我们 | 联系我们

库存查询

• 非库存货

产品规格

封装/外壳	4-SMD
制造商	Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
安装类型	表面贴装
工作温度	-40°C ~ 125°C
类型	SAW
系列	B39431
包装	带卷（TR）
频率	-
频率稳定度	±50ppm
大小/尺寸	0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）
零件状态	在售
频率容差	-
高度	0.057"（1.45mm）
特性	-
阻抗	50 Ohms
关键词

产品资料

标准包装	9,000
其它名称	B39431R 970H110 B39431R 970H110W 3 B39431R0970H110W03 B39431R970H110 B39431R970H110-ND R0970

封装/外壳 4-SMD  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 封装/外壳 4-SMD  谐振器 封装/外壳 4-SMD  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 封装/外壳 4-SMD   制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)  谐振器 制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)   安装类型 表面贴装  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 安装类型 表面贴装  谐振器 安装类型 表面贴装  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 安装类型 表面贴装   工作温度 -40°C ~ 125°C  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 工作温度 -40°C ~ 125°C  谐振器 工作温度 -40°C ~ 125°C  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 工作温度 -40°C ~ 125°C   类型 SAW  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 类型 SAW  谐振器 类型 SAW  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 类型 SAW   系列 B39431  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 系列 B39431  谐振器 系列 B39431  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 系列 B39431   包装 带卷（TR）   Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 包装 带卷（TR）   谐振器 包装 带卷（TR）   Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 包装 带卷（TR）    频率 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 频率 -  谐振器 频率 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 频率 -   频率稳定度 ±50ppm  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 频率稳定度 ±50ppm  谐振器 频率稳定度 ±50ppm  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 频率稳定度 ±50ppm   大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）  谐振器 大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）   零件状态 在售  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 零件状态 在售  谐振器 零件状态 在售  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 零件状态 在售   频率容差 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 频率容差 -  谐振器 频率容差 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 频率容差 -   高度 0.057"（1.45mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 高度 0.057"（1.45mm）  谐振器 高度 0.057"（1.45mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 高度 0.057"（1.45mm）   特性 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 特性 -  谐振器 特性 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 特性 -   阻抗 50 Ohms  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 阻抗 50 Ohms  谐振器 阻抗 50 Ohms  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 阻抗 50 Ohms