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• 已过时的产品。

产品规格

封装/外壳	4-SMD
制造商	Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
安装类型	表面贴装
工作温度	-
类型	SAW
系列	-
包装	带卷（TR）
频率	-
频率稳定度	-
大小/尺寸	0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）
零件状态	过期
频率容差	-
高度	0.057"（1.45mm）
特性	-
关键词

产品资料

标准包装	3,000
其它名称	B39871R 808H210 B39871R808H210 B39871R808H210-ND R0808

封装/外壳 4-SMD  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 封装/外壳 4-SMD  谐振器 封装/外壳 4-SMD  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 封装/外壳 4-SMD   制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)  谐振器 制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 制造商 Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)   安装类型 表面贴装  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 安装类型 表面贴装  谐振器 安装类型 表面贴装  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 安装类型 表面贴装   工作温度 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 工作温度 -  谐振器 工作温度 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 工作温度 -   类型 SAW  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 类型 SAW  谐振器 类型 SAW  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 类型 SAW   系列 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 系列 -  谐振器 系列 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 系列 -   包装 带卷（TR）   Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 包装 带卷（TR）   谐振器 包装 带卷（TR）   Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 包装 带卷（TR）    频率 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 频率 -  谐振器 频率 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 频率 -   频率稳定度 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 频率稳定度 -  谐振器 频率稳定度 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 频率稳定度 -   大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）  谐振器 大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 大小/尺寸 0.197" 长 x 0.138" 宽（5.00mm x 3.50mm）   零件状态 过期  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 零件状态 过期  谐振器 零件状态 过期  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 零件状态 过期   频率容差 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 频率容差 -  谐振器 频率容差 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 频率容差 -   高度 0.057"（1.45mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 高度 0.057"（1.45mm）  谐振器 高度 0.057"（1.45mm）  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 高度 0.057"（1.45mm）   特性 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 特性 -  谐振器 特性 -  Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) 谐振器 特性 -